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MADP-017025-1314 MADP-030025-1314
SURMOUNTTM 25M PIN Diodes RoHS Compliant
Case Style ODS 1314 Features

0603 Outline Surface Mount 25m I-Region Length Devices No Wirebonds Required Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling
Rev. V5
Description
This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM's patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for usage in moderate incident power, 50dBm/C.W. or where the peak power is 75dBm, pulse width is 1S, and duty cycle is 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts.
Chip Dimensions
DIM A B C D E F G
Notes:
1) Backside metal: 0.1microns thick. 2) Yellow area with hatch lines indicate backside ohmic gold contacts. 3) Both devices have same outline dimensions ( A to G).
INCHES Min 0.060 0.031 0.004 0.019 0.019 0.019 0.029 Max 0.062 0.032 0.008 0.021 0.021 0.021 0.031 Min 1.525 0.775 0.102 0.475 0.475 0.475 0.725
MM Max 1.575 0.825 0.203 0.525 0.525 0.525 0.775
Absolute Maximum Ratings1 @ TA = +25C
(unless otherwise specified)
Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature C.W. Incident Power Peak Incident Power (dBm) Mounting Temperature
1
Absolute Maximum 500 mA - 135 V -55C to +125C -55 C to +150C +175C +44dBm MADP-017025 +47dBM MADP-030025 +50 dBm, 10S, 1% duty +280C for 30 seconds
1) Exceeding these limits may cause permanent damage
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.4155721 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MADP-017025-1314 MADP-030025-1314
SURMOUNTTM 25M PIN Diodes RoHS Compliant
Electrical Specifications @ TA = 25C (unless otherwise noted)
Parameter
Capacitance 1 Capacitance
1
Rev. V5
Symbol
CT CT CT RS RS RS RS VF IR
Conditions
- 40V, 1MHz 1 - 40V, 1GHz
1,3
Units
pF pF pF V A
Min
Typ
0.23 0.23 0.22 1.01 0.64 1.48 1.03 0.74 -
Max
0.29
Min
Typ
0.50 0.50 0.65 0.45 -
Max
0.56
MADP-017025
MADP-030025
Capacitance 1, 85C Resistance
2
- 40V, 1GHz 1,3 +10mA, 1GHz
2,3
Resistance 2 Resistance , 85C Resistance 2, 85C Forward Voltage Reverse Leakage Current Third Order Intercept Point C.W. Thermal Resistance Lifetime
2
+70mA, 1GHz 2,3 +10mA, 1GHz
2,3
+70mA, 1GHz 2,3 +10mA | -135V | F1 = 1800MHz F2 = 1810MHz Input Power = +39dBm CW I bias = +70mA IH = 0.5A, IL= 10mA +10mA / -6mA ( 50 % - 90 % V )
0.90 10
0.73 -
0.90 10
IP3
dBm
76
77
RqJL
C/W
30
13
TL
uS
2.3
2.8
Notes: 1) Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. 2) 3) Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance) Rs and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS213 package with 80/20, Au/Sn solder.
MADP-0XX025 Series Typical Spice Parameters @ +25C
Spice Parameter Units
MADP-017025-1314 MADP-030025-1314
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.4155721 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
N 1.1 1.1
RS
1.4 1.3
IS A
5.1E-15 7.8E-15
IK
BV
IBV
Ct
CJO
VJ
M 0.50 0.50
FC 0.12 0.07
Cpar_Cj (F)
2.7E-13 5.3E-13
(mA) (Volts) (A)
12.6 12.7 175 175 10 10
(pF) (pF) (Volts)
0.38 0.80 0.10 0.27 0.17 0.12
MADP-017025-1314 MADP-030025-1314
SURMOUNTTM 25M PIN Diodes RoHS Compliant
MADP-0XXX15 Series Typical Performance Curves @ +25C
Ct vs. V
1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 0
10.00 Rs @ 1GHz (ohm)
Rev. V5
Rs vs. I
Ct @ 1GHz (pF)
MADP-030025
MADP-017025 1.00 MADP-030025
MADP-017025 10 20 Voltage (V) 30 40
0.10 0.001 0.01 Current (A) 0.1
Ct vs. Freq.
0.8 0V 10V 40V 0V 10V 40V MADP-17025 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0.7 0.6 Ct (pF) 0.5 0.4 0.3 0.2 0.1 0 Frequency (GHz) MADP-30025
Ls vs. Freq.
0.2 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 0 0.2 0.4
Ls @ 5, 10, 20mA (nH)
MADP-17025 MADP-30025
0.6
0.8
1
1.2
1.4
1.6
1.8
Frequency (GHz)
Rs vs. Freq.
1.6 1.4 1.2 Rs (ohm) 1.0 0.8 0.6 0.4 0.2 0.0 0.0
3
Ls vs. I
0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 MADP-017025
MADP-017025
10mA 20mA 5mA 10mA 20mA MADP-030025
Ls @ 1GHz (nH)
5m A
MADP-030025
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.02
0.04
0.06
0.08
0.1
Frequency (GHz)
Current (A)
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.4155721 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MADP-017025-1314 MADP-030025-1314
SURMOUNTTM 25M PIN Diodes RoHS Compliant Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Rev. V5
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder or conductive epoxy attachment onto hard and soft substrates. The use of 60/40, Pb/Sn, 80/20, Au/Sn or any other lead-free solder is recommended to achieve the lowest series resistance and optimum heat sink. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the die. Both mounting pads should be heated simultaneously so that the solder under both pads flows at the same time. The solder joint should not be made one at a time. By doing so, would create an un-equal heat flow and potentially create thermal stress to the chip. Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be uniformly heated in a re-flow oven. Proper flow is easily determined looking down from the top since the HMIC glass is transparent and the edges of the mounting pads can be visually inspected through the die after attachment is complete. A typical soldering process profile and handling instructions are provided in Application Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the MA-COM website at www.macomtech.com. Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the average power is < 1 W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per manufacturer's recommended schedule.
Ordering Information
Part Number MADP-017025-13140G MADP-017025-13140P MADP-030025-13140G MADP-030025-13140P
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.4155721 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
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